UT12002
Key Features
- Meets IEEE 802.3 and ANSI X.3.263 standards including 350uH OCL with 8mA bias
- Designed for reflow soldering at temperature 230±5o C
- pact footprint for use in the most space restrictive applications
- Turns Ratio tolerance: ±5%
- Operating temperature: -40o C to +85o C Electrical Specification @25 o C
- Insertion Loss : -1.1dB Max. @ 0.10--100MHz. TX/RX
- Return Loss : -20dB Min. @ 30MHz. TX/RX -14dB Min. @ 60MHz. TX/RX -11.5dB Min. @ 80MHz. TX/RX
- Diff. to . Mode Rejection : -42dB Min. @ 30MHz. TX/RX -37dB Min. @ 60MHz. TX/RX -33dB Min. @ 100MHz. TX/RX
- Cross Talk : -45dB Min. @ 30MHz. TX to RX -40dB Min. @ 60MHz. TX to RX -35dB Min. @ 100MHz. TX to RX
- HI-POT : 1500Vrms/2sec. Leakage Current 0.5mA Max./input to output
